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Old Dec 16th 2016, 08:59 AM   #1
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Join Date: Dec 2016
Posts: 1
Post Heat Transfer Application examples of using fins

Im struggling a bit with this problem.

I dont know how to sketch the equivalent thermal circuit for any of them. Does it have to look like anything like that?

the thermal circuits are for b) parallel connectd right? and for aswell?
And im getting wrong answers for a). Shouldnt it be like this?
Q= he*Ab^2*55 + 1/((1/hi)+(Lb/kb))*Ab^2*55
or are they all parallel? like this Q=Ab^2*1/((1/hi)+(Lb/kb)+(1/he)) .
My first thought was that the heat rate dissipating on the chip side is the same as the heat rate on the board side. why is this thought wrong? im confused
thank you for your answers
Best regards
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